Flashless lead frame with horizontal singulation

ABSTRACT

A lead frame is configured for use with a singulation apparatus that eliminates flash. A die pad is attached to sides of the frame by tie bars and peripheral portions. The peripheral portions have cutout sections defining openings that are bridged by lead frame segments. The apparatus applies a downward force to the lead frame segments and translates the downward force to a horizontal force applied to the tie bars. The singulation process confines movement of the lead frame metal to within the plane of the lead frame.

FIELD OF THE INVENTION

The present invention relates to lead frames for semiconductor packages,more particularly to the separation of one or more such packages from acommon lead frame.

BACKGROUND

Typical processing of an integrated circuit produces an encapsulatedpackage within which an IC die is supported by a die pad, with bondwires connected from bond pads disposed on the die to respective leadsthat extend externally from the encapsulated package. A generallyplanar, metal strip with patterned openings is used as a lead frame uponwhich several IC packages will be fabricated and thereafter separatedfrom the lead frame. FIG. 1 is a perspective view of a portion of atypical lead frame 10 for one IC package prior to formation of thepackage. The dashed line block 12 circumscribes a portion of the metalstrip that will be part of the package after completion of the process,including a die pad 14 and individual leads 16. The die pad is shownattached to the periphery of the lead frame by tie bars 20, whichcontain notches 22. The IC package is fabricated by adhesively mountinga die to the die pad, forming bonding connections between individualbond pads on the die and respective leads 16, and applying a moldingcompound to encapsulate the die pad, bond wires and leads substantiallywithin the area defined by block 12. Thereafter, leads are detached fromthe common connection with the lead frame and further processed toobtain desired lead configurations. At this stage, the encapsulatedpackage remains attached to the lead frame periphery by tie bars 20.

With standard methodology, separation of the encapsulated semiconductorpackage from the lead frame, commonly termed “singulation,” is achievedusing tools that apply load directly to the package. The lead frameperiphery is clamped and forced to separate from the package by thrustof a punch. The punch tends to force the package out of the plane of thesupporting members, thus placing the connecting tie bar metal intension. The deformed metal reaches its ultimate strength until a breakoccurs at notches 22. The forces applied to the package create a momentdirectly related to the application of the force. This moment can bedevastating to the molded unit, resulting in silicon die cracking and/orplastic package cracking.

An additional problem encountered with conventional singulationtechniques is the formation of “flash.” Flash is the result of theplastic molding operation. Due to tooling tolerances, the lead framemust maintain a distance from the edge of the molded unit to thesingulation paring line. Flash is the plastic material that is trappedaround the separation area of the lead frame. Plastic molding materialprotrudes from the package ends with varying degrees of distance. Thepresence of flash raises concerns that must be addressed in the methodsof delivery of IC packages. Typical delivery methods include “tape andreel” delivery and “tube” delivery. With tape and reel delivery, unitsare placed into a pocket which is then sealed by tape. The size of thepocket must be chosen to accommodate all molded unit packages. Sinceflash tends to vary in a random fashion, large pockets must be provided.A tube delivery system transports a plurality of IC packages in eachtube. A “shingling” problem often occurs as a result of flashinteraction between adjoining packages, wherein the units are wedged inplace within the tube. Safe and expedient removal of the packages fromthe tube becomes a difficulty.

The need thus exists for a singulation method and apparatus that avoiddamaging the semiconductor packages, eliminate flash, and for animproved lead frame configuration that is compatible with such methodand apparatus.

DISCLOSURE OF THE INVENTION

The present invention fulfills the above-described needs of the priorart at least in part by avoiding the bending moment force incident toconventional singulation techniques. A lead frame is appropriatelyconfigured for use with the apparatus of the invention and forelimination of flash. A die pad is attached to sides of the frame by tiebars and peripheral portions. The peripheral portions have cutoutsections defining openings that are bridged by lead frame segments. Theapparatus appropriately applies a force to the lead frame segments forseparation of the tie bars from the package during singulation, whileconfining movement of the lead frame metal to within the plane of thelead frame.

The apparatus advantageously includes a generally planar supportingplatform having a cavity recessed for accommodating a portion of anencapsulated semiconductor package when the lead frame and semiconductorpackage are placed on a surface of the platform. A slot in thesupporting platform is separated from the cavity by an intermediateportion of the platform. Lead frame segments connected between the leadframe periphery and the semiconductor package overlay the intermediateportion and the slot. A clamping platform having a vertical slotextending therethrough is aligned with the slot in the supportingplatform when the clamping platform is appropriately positioned on thesupporting platform, with the lead frame and attached semiconductorpackage positioned therebetween. A surface of the clamping platform thatmates with the supporting platform comprises a recess generallyconforming to and aligned with the cavity in the supporting platform, sothat the encapsulated package is encompassed within the space created bythe clamping platform recess and the supporting platform cavity. Theportion of the clamping platform between the recess and the slot isrecessed from the surface to a lesser degree.

A punch instrument, configured to conform with the slot in the mountingplatform, can be thrust downwardly to separate the lead frame segmentsfrom the semiconductor package. The punch instrument preferably isjoined to a thrusting platform that is slidably engageable with theclamping platform in a direction perpendicular to the plane of the leadframe. The slot in the supporting platform is generally parallel to asidewall of the cavity, the intermediate portion surface therebetweenforming a rib for supporting the lead frame segments that are to beseparated from the semiconductor package. A similar slot may be providedparallel and adjacent to an opposite sidewall of the cavity forseparating lead frame segments on the other side of the semiconductorpackage. The clamping and thrusting platforms are provisioned withrespect to the second slot in similar fashion; the arrangement can bereplicated to accommodate a plurality of semiconductor devices that areconnected to the lead frame. Thus, the supporting platform may comprisea plurality of cavities, a pair of slots adjacent each cavity, themounting platform having a plurality of slots for alignment with theslots in the supporting platform, and the thrusting platform is providewith a plurality of punches, whereby a plurality of semiconductorpackages can be severed simultaneously from a single lead frame.Preferably, the cavities are configured in the supporting platform in anarray of rows, each row comprising a plurality of cavities. Asubstructure upon which the supporting platform can be removably placedis configured with rows of recesses that are aligned respectively withthe rows of the cavities in the supporting platform. Semiconductorpackages that are separated from the lead frame are deposited incorresponding recesses of the substructure.

Additional advantages of the present invention will become readilyapparent to those skilled in this art from the following detaileddescription, wherein only the preferred embodiment of the invention isshown and described, simply by way of illustration of the best modecontemplated of carrying out the invention. As will be realized, theinvention is capable of other and different embodiments, and its severaldetails are capable of modifications in various obvious respects, allwithout departing from the invention. Accordingly, the drawings anddescription are to be regarded as illustrative in nature, and not asrestrictive.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention is illustrated by way of example, and not by wayof limitation, in the figures of the accompanying drawing and in whichlike reference numerals refer to similar elements and in which:

FIG. 1 is a perspective view of a portion of a typical lead frame for anIC package.

FIG. 2 is a perspective view of a portion of a lead frame in accordancewith the present invention.

FIG. 3 is a perspective view of the lead frame portion of FIG. 2 withthe encapsulation package shown transparently.

FIG. 4 is a perspective view of the lead frame portion of FIG. 2 afterthe leads have been separated from the lead frame.

FIG. 5 is a perspective view of a singulation apparatus in accordancewith the present invention.

FIG. 6 is a perspective view of a supporting platform component of theapparatus of FIG. 5.

FIG. 7 is a perspective view of the supporting platform of FIG. 6 havingplaced thereon a lead frame in accordance with the present invention.

FIG. 8 is a partial perspective view of the apparatus of FIG. 5.

FIG. 9 is a perspective view of a substructure of the apparatus of FIG.5.

DETAILED DESCRIPTION OF THE INVENTION

A lead frame 10 in accordance with the present invention is shown inFIG. 2. While only a single semiconductor package frame portion isshown, the configuration is replicated on a single metal strip toaccommodate a plurality of semiconductor packages as described below.Die pad 14 is attached to opposite sides 24 of the lead frame by tiebars 20 via peripheral portions. Each peripheral portion comprisescutout sections, or openings 26, and lead frame segments 28 that bridgethe openings between outer peripheral portion 18 and inner peripheralportion 19. The lead frame segments are substantially in alignment withthe tie bars and separated therefrom by the peripheral portions 19. Thesemiconductor encapsulation, which is formed before the leads areseparated processed, is bounded as shown in transparency in FIG. 3. Theencapsulated package 32 extends above and below the lead frame bysubstantially the same distance. FIG. 4 depicts the lead frame after theleads 16 have been detached and processed. The encapsulated package,other than the lead frame, has been deleted for clarity of illustration.

At this stage, the package is attached to the lead frame only by thenotched tie bars 20 and only singulation is required to complete thepackage process. Apparatus for performing singulation according to thepresent invention is shown in the three-dimensional perspective view ofFIG. 5. The apparatus comprises a lower section 40 and an upper section60. Support platform 42 of the lower section is removably coupled withthe substructure 52 in the position shown. Lead frame 10, to which areattached a plurality of encapsulated packages, is supported by thesupport platform, which is shown in more detail in FIG. 6. Substructure52 is shown in more detail in FIG. 9.

In upper section 60, clamping platform 62 is slidably engageable withthrusting platform 80 by means of spring loaded guides 64. A pluralityof vertically oriented slots 66 extend from upper surface 68 of clampingplatform 62 to the lower surface 70, shown in FIG. 8. Extendingdownwardly from the thrusting platform are a plurality of punchinstruments equal in number to the number of slots 66. The punchinstruments are vertically aligned with the slots 66 and configured tofit within, and extend beyond, the slots when the lower thrustingplatform is moved downwardly to fully engage clamping platform 62.

The support platform 42, shown in FIG. 6, has a generally planar uppersurface 43. An array of slots 44 and cavities 46 are provided forsupporting a lead frame having six encapsulated IC packages attachedthereto. Each cavity 46 is separated from a slot 44 on opposites sidesby an intermediate support portion 48 for accommodating one of theencapsulated packages of the lead frame. The upper surface of theintermediate portion is in the plane of surface 43. Holes 50 areprovided for aligning support platform 42 of lower section 40, with alead frame 10 and clamping platform 62 of upper section 60.

The lower surface 70 of clamping platform 62 can be seen in FIG. 8. Sixrecesses 72 conform in perimeter, and are aligned, with thecorresponding cavities 46 in the supporting platform. The recesses aresufficiently deep to provide enough space encompass the portions of theencapsulated packages that are above the plane of the lead frame. Theportions 74 of the clamping platform that are between the recesses andslots also are recessed from the surface 70. Substructure 52 containthree channels 54, as seen more clearly in FIG. 9. Each channel isaligned with a pair of cavities 46 in the support platform and serves asa repository for the IC packages after singulation has been completed.

In the singulation operation, the lead frame 10 is placed, with theencapsulated IC packages attached, on the supporting platform 42 asshown in FIG. 7. Each encapsulated package 32, and its associated leads16, overlays a cavity 46 without contact with surface 43 of the supportplatform. The bulk of each encapsulation package that is below the planeof lower surface of the lead frame extends into a respective cavity. Thelead frame is in contact with the support platform except for the leadframe segments 28 that overlay the slots 44. The tie bars 20 on oppositesides of each package are in contact with, and supported by, theintermediate portions 48 of the support platform.

The upper section 60 is then mounted on the support platform and alignedtherewith so that slots 66 overlay slots 44 and recesses 72 overlaycavities 46. The lead frame is clamped between the platform 62 of theupper section and the support platform 42. Platform 80 is then thrustdownwardly to drive the punch instruments 82 through the aligned slots66 in clamping platform 62 to impose a downward force on the lead framesegments 20 simultaneously on both opposite sides of the packages. Asthe tie bars are supported by intermediate portions 48 of the supportplatform, the downward force creates a horizontal force on the tie bars,which is sufficient to cause separation of the tie bars from theencapsulated packages at the notches 22. Horizontal movement of the tiebars is not impeded by the clamping platform due to the recesses 74 inthe surface 70. The packages are then completely detached from the leadframe and are individually deposited in the channels 54 of substructure52.

Singulation has been achieved without imposition of bending forces onthe packages that can cause damage. As there is no protrusion of moldingmaterial from the package ends, flash has been eliminated.

In this disclosure there are shown and described only preferredembodiments of the invention and but a few examples of its versatility.It is to be understood that the invention is capable of use in variousother combinations and environments and is capable of changes ormodifications within the scope of the inventive concept as expressedherein.

1. Apparatus for separating a semiconductor package from a lead frameattached thereto by tie bars, said apparatus comprising: a generallyplanar supporting platform having a cavity and a slot separated from thecavity by an intermediate portion of the platform for supporting thelead frame when the lead frame and semiconductor package are placed on asurface of the platform, the cavity being dimensioned to encompass thesemiconductor package, with lead frame segments overlaying the slot; aclamping platform for clamping the lead frame to the supporting platformwhen mounted thereon, the clamping platform having a slot therethroughthat is aligned with the slot in the supporting platform; and means forseparating the tie bars from the semiconductor package in a directionparallel to the surface of the supporting platform.
 2. Apparatus forseparating a semiconductor package from a lead frame attached thereto bytie bars, said apparatus comprising: a generally planar supportingplatform having a cavity and a slot separated from the cavity by anintermediate portion of the platform for supporting the lead frame whenthe lead frame and semiconductor package are placed on a surface of theplatform, the cavity being dimensioned to encompass the semiconductorpackage, with lead frame segments overlaying the slot; a clampingplatform for clamping the lead frame to the supporting platform whenmounted thereon, the clamping platform having a slot therethrough thatis aligned with the slot in the supporting platform; and a thrustingplatform slidably engageable with said clamping platform.
 3. Apparatusas recited in claim 2, further comprising a a punch attached to saidthrusting platform for separating the tie bars from the semiconductorpackage in a direction parallel to the surface of the supportingplatform.
 4. Apparatus as recited in claim 3, wherein the slot in thesupporting platform is generally parallel to a first sidewall of thecavity and the supporting platform further comprises a second slotgenerally parallel to a second sidewall of the cavity.
 5. Apparatus asrecited in claim 4, wherein said clamping platform further comprises asecond slot that is aligned with the second slot in the supportingplatform when the clamping platform is mounted on the supportingplatform, and the thrusting platform comprises a second punch configuredto conform with the second slot in the clamping portion.
 6. Apparatus asrecited in claim 4, wherein said clamping platform further comprises arecess generally conforming with and aligning with the cavity in thesupporting platform.
 7. Apparatus as recited in claim 4, wherein saidsupporting platform comprises a plurality of said cavities, a pair ofslots adjacent each cavity, said clamping platform comprises a pluralityof slots for alignment with the slots in the supporting platform, andsaid thrusting platform comprises a plurality of punches, whereby aplurality of semiconductor packages can be singulated simultaneouslyfrom a single lead frame.
 8. Apparatus as recited in claim 7, whereinsaid cavities are configured in the supporting platform in an array ofrows, each row comprising a plurality of cavities, and said apparatusfurther comprises a substructure upon which the supporting platform isremovably coupled, said substructure comprising channels that arealigned respectively with the rows of the cavities in the supportingplatform, whereby semiconductor packages that are separated from thelead frame are deposited in the recesses of the substructure.
 9. Amethod for separating an encapsulated semiconductor package from a leadframe attached thereto by tie bars, the method comprising the steps of:clamping the lead frame between two planar surfaces; supporting the tiebars at locations proximate to the encapsulated package; applying athrusting force to peripheral lead frame segments in a directionperpendicular to the plane of the surfaces, thereby separating the tiebars from the semiconductor package in a direction parallel to the planeof the surfaces.
 10. A method as recited in claim 9, wherein theclamping step comprises the steps of: placing the lead frame withattached semiconductor package on a supporting platform having a cavityfor containing a portion of the semiconductor package, the peripherallead frame segments positioned over a slot in the supporting platformand the tie bars positioned over an intermediate portion of thesupporting frame proximate the cavity; and mounting a slotted platformon the lead frame and the supporting platform so that a slot in theslotted platform is aligned with a slot in the supporting platform. 11.A method as recited in claim 10, wherein said applying step comprisesthe steps of: inserting a punch instrument into the slot in the slottedplatform; and forcibly advancing the punch instrument through the leadframe segments and into the slot in the supporting platform.
 12. Amethod as recited in claim 10, wherein said supporting platformcomprises a pair of slots adjacent respective sidewalls of the cavitycorresponding to locations of lead frame segments on first and secondsides of the semiconductor package to be separated, and said applyingstep comprises simultaneously forcibly advancing a plurality of punchinstruments in slots in said slotted platform to the lead framesegments.
 13. A method as recited in claim 12, wherein the plurality ofpunch instruments are mounted on a common member and said step offorcibly advancing comprises mating the common member with the slottedplatform.
 14. A lead frame for use in an integrated circuit package, thelead frame comprising: a generally planar, metal strip with patternedopenings interior of a rectangular periphery; a plurality of leadsattached to opposite sides of the frame; and a die pad attached to sidesof the frame, which are orthogonal to said opposite sides, by tie barsand peripheral portions, said peripheral portions having cutoutsections, the cutout sections having openings and lead frame segmentsthat bridge the openings.
 15. A lead frame as recited in claim 14,wherein said lead frame segments are substantially in alignment withsaid tie bars in a direction generally parallel to said opposite sides.16. Apparatus for separating a semiconductor package from a lead frameattached thereto by lead frame segments, said apparatus comprising: asupporting platform, having a cavity and a slot separated from thecavity, for supporting the lead frame with a lead frame segmentoverlaying the slot; a clamping platform, having a slot therethrough,for clamping the lead frame to the supporting platform when mountedthereon with the clamping platform slot aligned with the slot in thesupporting platform; and a thrusting device engageable with the slot inthe clamping platform to separate said lead frame segment from thesemiconductor package in a direction parallel to the surface of thesupporting platform.
 17. Apparatus as recited in claim 16, wherein thecavity is dimensioned to encompass the semiconductor package. 18.Apparatus as recited in claim 16, wherein said clamping platformcomprises a plurality of slots that is aligned with a plurality of slotsin the supporting platform when the clamping platform is mounted on thesupporting platform, and the thrusting device is engageable with each ofthe slots in the clamping platform to separate a plurality of lead framesegments from the semiconductor package in a direction parallel to thesurface of the supporting platform.
 19. A method for separating asemiconductor package from a lead frame attached thereto by lead framesegments, the method comprising the steps of: clamping the lead framebetween two planar surfaces; supporting the lead frame segments atlocations proximate to the encapsulated package; and applying athrusting force to the lead frame segments to separate the lead framesegments from the semiconductor package in a direction parallel to theplanes of the surfaces.